dense foam sheets fabrication en ligne

Gray 7.0W Ultra-High Thermal Conductive Silicone Gel For Telecom Industry TIF®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher ... Lire la suite

Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe Heat Sinks TIF® 030-05 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal ... Lire la suite

High Temperature Thermal Grease Silicone Based Thermal Compound Designed for heat transfer and electronic device thermal management applications requiring both cost efficiency and performance. Product Overview TIG®️ 780-50 is a paste-like thermal interface material specifically designed for heat ... Lire la suite

Silicone Thermal Grease With 5.0W/mK High Thermal Conductivity For Heat Sink And Electronic Component Product Overview TIG®️ 780-50 is a paste-like thermal interface material designed specifically for the heat dissipation of various high and medium power electronic components. Under typical assembly ... Lire la suite

Durable Silicone Foam Gasket With High Compression And Creep Resistance Ideal For Cushioning And Noise Reduction Applications Product Overview Z-Foam ®800-10SEC Series combines the inherent advantages of silicone polymer, including high/low temperature resistance, UV/ozone resistance, weatherability... Lire la suite

Application In Electronic Parts High Thermal Conductivity 3.0W/MK Thermal Conductive Silicone Pad For AI Servers Thermal Management Product Overview The TIF®️ 140-30-15E Series is recommended for applications that require minimal pressure on components. The viscoelastic nature of the material ... Lire la suite

Thermal Conductive Pad Providing Thermal Interface Solution To Enhance Heat Dissipation And Maintain Electronic Component Stability Company Profile Ziitek, founded in 2006 and headquartered in Dongguan, Guangdong Province, is the world's leading manufacturer of thermal interface materials and ... Lire la suite

High Thermal Conductivity Silicone Thermal Pad - 3.0W/MK Blue Thermal Gap Filler Pad for AI Server Thermal Management Product Overview TIF®️100-30-05E Series is a well-balanced, general-purpose thermal pad offering excellent thermal conductivity and moderate hardness. This balanced design provides ... Lire la suite