La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Goolsby
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello Sau
Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !
Thermal Adhesive Tape Providing Durable And Thermal Conductivity For Mounting Heat Sinks And Managing Semiconductor Heat The TIA® 800FG Series is widely used for bonding heat sinks to microprocessors and other ... Lire la suite
0.3mm Thickness IGBT Heatsink white Thermal Adhesive Tape With Glass Fiber Backing Acrylic The TIA®812 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal conductivity... Lire la suite
Heatsink Cooling Thermal Insulation Tape Double Sided with Glass Fiber Backing Type 0.8W/mK The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lire la suite
Acrylic Thermal Adhesive Tape For LED Mount Heat Sink Conductive 0.8 W/MK The TIA™805FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconduct... Lire la suite
High Performance blue Acrylic Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lire la suite
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lire la suite
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Lire la suite
High-performance Heat-conductive Acrylic Adhesive Tape Double-sided Adhesive Thermal Adhesive Tape For Led Module The TIA® 800AL Series is widely used for bonding heat sinks to microprocessors and other power ... Lire la suite
Good Adhesion Glass Fiber Mesh Strengthening High Temperature Heat Dissipation Double-Sided Tape Substitute screw The TIA™800AL Series products are mostly used for bonding heat dissipation fins, microprocessors ... Lire la suite
RoHS Certified 6.5W/M.K Thermal Pads Silicone Cooling Pad With Self-Adhesive For PC Laptop The TIF®500-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision ... Lire la suite