La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Goolsby
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello Sau
Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !
—— Chris Rogers
Je suis en ligne une discussion en ligne
high temperature phase change materials fabrication en ligne
Product Overview The TIC® 800G Series is a high-reliability, high-thermal-conductivity phase change material (PCM) engineered for demanding thermal management in CPUs, GPUs, and other high-power-density ... Lire la suite
Thermal Conductive Phase Change Material 9.6W/mK With The Good Flow Ability Over Phase Change Temperature For Chip Sets The TIC® 800T Series is an ultra-high thermal conductivity phase change material with a ... Lire la suite
Excellent Thermal Conductivity Phase Change Material for Server CPU TIC® 800H Series is an ultra-high thermal conductivity phase change material featuring a unique grain orientation structure. Through a micro... Lire la suite
1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery Product Overview TIF® 400 Series is a well-balanced, general-purpose thermal pad offering good thermal ... Lire la suite
3.0 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 35 shore00 TIF100-30-12E The TIF100-30-12E thermal silicone pad is a product with both performance and economy. It is a unique ... Lire la suite
Product Overview TIC® 800R Series is an ultra-high thermal conductivity phase change material featuring a unique grain orientation structure. Through a micro-ordered arrangement, this structure achieves ... Lire la suite
Product Overview TIC® 800G Series is a thermally conductive phase change material engineered for high reliability and high thermal conductivity. Solid at room temperature for easy handling and installation, the ... Lire la suite
Product Overview TIC® 800G Series is a thermally conductive phase change material engineered for high reliability and high thermal conductivity. It remains solid at room temperature, which simplifies handling ... Lire la suite
High Thermal Conductivity 5.0 W/mK Phase Change Materials for Smartphone Main Chip TIC® 800G Series is a thermally conductive phase change material engineered for high reliability and high thermal conductivity. ... Lire la suite
Phase Change Pad Low Thermal Resistance Phase Change Material TIC™805P series is low melting point thermal interface material.At 50℃, TIC™800P series begins to soften and flow, filling the microscopic ... Lire la suite