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Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

Je suis en ligne une discussion en ligne

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Image Grand :  Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Détails sur le produit:
Place of Origin: China
Nom de marque: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-65-11ES
Conditions de paiement et expédition:
Minimum Order Quantity: 1000pcs
Prix: Négociable
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Description de produit détaillée
Features: High compliance adapts to various pressure application environments Product name: Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs
Keywords: Silicone Thermal Pad Thermal conductivity: 6.5W/m-K
Thickness: 0.020~0.20inch(0.50~5.0mmT) Hardness: 12 Shore 00
Fire rating: 94-V0 Application: For Advanced Cooling Needs

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

 

Products Discription

TIF®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of theheat-generating electroniccomponents.

Features

> Excellent thermal conductivity: 6.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

Applications

> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

 

Typical Properties of TIF®100-65-11ES Series
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness 0.020~0.20inch(0.50~5.0mmT) ASTM D374
Specific Gravity 3.4g/cc ASTM D792
Hardness 12 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity ≥1.0X1012 Ohm-meter ASTM D257
Fire rating 94-V0 UL E331100
Thermal conductivity 6.5W/m-K ASTM D5470

 

Product Specification
Standard Thickness: 0.02"(0.50 mm)-0.20" (5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size: 16"X16" (406 mmX406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs 0

Packaging Details & Lead time
 
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
 
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

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This message should include any questions you might have about the products as well as your purchase requests.

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Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

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