logo
Aperçu ProduitsPlot conducteur thermique

8W/m-K Thermal Conductive Silicone Pad 1.0mm for CPU GPU EV Battery

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

Je suis en ligne une discussion en ligne

8W/m-K Thermal Conductive Silicone Pad 1.0mm for CPU GPU EV Battery

8W/m-K Thermal Conductive Silicone Pad 1.0mm for CPU GPU EV Battery

Image Grand :  8W/m-K Thermal Conductive Silicone Pad 1.0mm for CPU GPU EV Battery

Détails sur le produit:
Place of Origin: China
Nom de marque: ZIITEK
Certification: UL and RoHs
Model Number: TIF740HQ Series
Conditions de paiement et expédition:
Minimum Order Quantity: 1000pcs
Prix: Négociable
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Description de produit détaillée
Products name: Insulation 8W/M-K 1.0mm Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery Hardness: 45±5 Shore 00
Construction: Ceramic filled silicone elastomer Thermal conductivity& Compostion: 8.0 W/m-K
Specific Gravity: 3.5g/cc Thickness: 1.0mmT
Color: Gray Continuos Use Temp: -45℃ to 200℃
Keywords: Thermal Conductive Silicone Pad
Mettre en évidence:

1.0mm thermal conductive silicone pad

,

CPU GPU thermal pad with warranty

,

EV battery thermal conductive silicone

Insulation 8W/M-K 1.0mm Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery

 

The TIF740HQ use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.


Features:


> Good thermal conductive:8.0W/MK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

 

Typical Properties of TIF740QE Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.5g/cc ASTM D297
thickness 1.0mmT ASTM D374
Hardness (thickness<1.0mm) 55±5 (Shore 00) ASTM 2240
Hardness (thickness≥ 1.0mm) 45±5 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0MHz ASTM D150
Volume Resistivity 1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 8.0W/m-K ASTM D5470

 

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

 

8W/m-K Thermal Conductive Silicone Pad 1.0mm for CPU GPU EV Battery 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

Envoyez votre demande directement à nous (0 / 3000)

Autres Produits