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5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

Je suis en ligne une discussion en ligne

5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

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Détails sur le produit:
Lieu d'origine: CHINE
Nom de marque: ZIITEK
Certification: UL and RoHs
Numéro de modèle: TIF800US
Conditions de paiement et expédition:
Quantité de commande min: 1000pcs
Prix: Négociable
Détails d'emballage: 1000pcs / sac
Délai de livraison: 3-5 jours de travail
Capacité d'approvisionnement: 10000 / jour
Description de produit détaillée
Nom de produit: 5,0 W de haute qualité Factory en gros PAD THERMAL PLAD THERMAL PAPIR THERMAL FEUILLE ISOLAGE PAD SI Mots clés: protection thermique de réémetteur isofréquence
Conductivité thermique: 5,0 W/m-K Construction & composition: Élastomère en silicone rempli en céramique
Échantillon: Gratuit Densité: 3,4 g / cm³
Dureté: 20 rivage 00 Épaisseur: Disponible varie dedans Thicknes
Application: Le processeur LED GPU MOS

5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

 

Products description

 

The TIF®800US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


> Good thermal conductive: 5.0W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance


Applications:


> Cooling components to the chassis of frame  
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook

 

Typical Properties of TIF®800US Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.4g/cc ASTM D297
Thickness range 0.020"(0.500)~0.200"(5.0mm) ASTM D374
Hardness 20 Shore 00 ASTM 2240
Operating temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5000 VAC ASTM D149
Dielectric Constant @1MHz 4.5 ASTM D150
Volume Resistivity ≥ 1.0X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing (TML) 0.55% ASTM E595
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO 22007-2

 

Products specification

 

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm) with increments of 0.01 inch(0.25mm).

Product Sizes: 8" x 16"(203mm x406mm)Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

5.0W High Quality Factory Wholesale Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS 0

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

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