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High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

Je suis en ligne une discussion en ligne

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Image Grand :  High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Détails sur le produit:
Lieu d'origine: CHINE
Nom de marque: ZIITEK
Certification: UL and RoHs
Numéro de modèle: Série TIF100-05S
Conditions de paiement et expédition:
Quantité de commande min: 1000pcs
Prix: Négociable
Détails d'emballage: 1000pcs / sac
Délai de livraison: 3-5 jours de travail
Capacité d'approvisionnement: 100000pcs / jour
Description de produit détaillée
Nom de produits: Remplisseur d'écart de refroidissement de tampon de silicone thermique hautement conducteur de haute Couleur: Bleu
Mots clés: Remplissage d'écart thermique Échantillon: Échantillon gratuit
temp d'utilisation continue: -45 à 200°C Dureté: 45 rivage 00
Conductivité thermique: 1,5 W/m-K Épaisseur: 0.020" (environ 0,5 mm) ~ 0,200" (environ 5,0 mm)
Application: Élément d'isolation CPU Premium

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

 

The TIF®100-05S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features


> Good thermal conductive: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook
> Power supply

 

Typical Properties of TIF®100-05S Series
Property Value Test method
Color Blue ******
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(0.50mm) ASTM D374
Specific Gravity 2.3g/cc ASTM D297
Hardness 45 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage > 5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0 X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing(TML) 0.35% ASTM E595
Thermal conductivity 1.5 W/m-K ASTM D5470

 

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

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Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

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