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1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

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1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

Image Grand :  1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

Détails sur le produit:
Lieu d'origine: CHINE
Nom de marque: ZIITEK
Certification: UL and RoHs
Numéro de modèle: Série TIF100-10S
Conditions de paiement et expédition:
Quantité de commande min: 1000pcs
Prix: Négociable
Détails d'emballage: 1000pcs / sac
Délai de livraison: 3-5 jours de travail
Capacité d'approvisionnement: 100000pcs / jour
Description de produit détaillée
Nom de produits: Coussin thermique à haute conductivité en caoutchouc de Silicone, isolation de remplissage d'esp Dureté: 45 rivage 00
Application: CPU GPU Semi-conducteur Dissipation thermique Conductivité thermique: 1,5 W/m-K
Couleur: Gris temp d'utilisation continue: -45 à 200°C
Échantillon: Échantillon gratuit Épaisseur: 0.020" (environ 0,5 mm) ~ 0,200" (environ 5,0 mm)
Mots clés: Coussin thermique

1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation

 

The TIF®100-10S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®100-10S is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.


Features


> Good thermal conductive: 1.5W/mK 
> Moldability for complex parts
> Soft and compressible for low stress applications
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS complian


Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

 

Typical Properties of TIF®100-10S Series
Property Value Test method
Color Gray ******
Construction &Compostion Ceramic filled silicone elastomer ******
Thickness range 0.020"(0.5mm)~0.200"(0.50mm) ASTM D374
Specific Gravity 2.3g/cc ASTM D297
Hardness 45 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage > 5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 2.0 X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Outgassing(TML) 0.35% ASTM E595
Thermal conductivity 1.5 W/m-K ASTM D5470

 

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.

 

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

 

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation 1

Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

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