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Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

Je suis en ligne une discussion en ligne

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Image Grand :  Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: ZIITEK
Certification: UL and RoHs
Numéro de modèle: TIF500-50-11US
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: Négociable
Détails d'emballage: 1000pcs / sac
Délai de livraison: 3-5 jours
Capacité d'approvisionnement: 100000pcs / jour
Description de produit détaillée
Nom du produit: Tampon thermique en Silicone 5.0W, feuille de Dissipation thermique à haute conductivité pour serveu Couleur: Gris foncé
Application: Serveurs IA, onduleurs, appareils télécoms Conductivité thermique: 5,0 W/m-K
Densité(g/cm³): 3.4 Constante diélectrique @1MHz: 4.5
Dureté: 65 côte00 Mots-clés: Coussinet thermique en silicone
Mettre en évidence:

Thermal silicone pad 5.0W high conductivity

,

Heat dissipation sheet for AI servers

,

Thermal conductive pad for inverters

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


The TIF®500-50-11US Series is an ultra soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with extreme gel grade flexibility to achieve a perfect fit with low stress.It is suitable for solving problems such as large tolerances,uneven surfaces, and susceptibility of precision components to mechanical damage in high-precision assembly.
 
Features:

>  Good thermal conductivity: 5.0W/mK

>  Ultra soft and highly compliant
>  Self-adhesive without the need for additional surface adhesives
>  Good insulation performance


Applications

 

>  AI Servers, Inverters, Telecom Devices

>  Power tools
>  Network communication products
>  Electric vehicle batteries Computer CPU/GPU Cooling
>  New energy vehicle power systems

 

Typical Properties of TIF®500-50-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.50)

0.030~0.200 (0.75~5.0) ASTM D374
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470

5.0 W/m-K

ISO22007

 

Product Specifications


Standard Thickness: 0.010"(0.25 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)


Component Codes:

 

Reinforcement Fabric: FG (Fiberglass).

Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

 

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Thermal Silicone Pad 5.0W High Conductivity Heat Dissipation Sheet For AI Servers, Inverters, Telecom Devices 0

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

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