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High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

Je suis en ligne une discussion en ligne

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Image Grand :  High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: ZIITEK
Certification: UL and RoHs
Numéro de modèle: Les produits de la catégorie 1 doivent être présentés dans la catégorie 1 de la présente annexe.
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: Négociable
Détails d'emballage: 1000 pièces/sac
Délai de livraison: 3-5 jours de travail
Conditions de paiement: T/T
Capacité d'approvisionnement: 10000 / jour
Description de produit détaillée
Nom du produit: Remplisseur d'espace thermique à base de silicone haute performance pour les serveurs AI des pro Température d'utilisation continue: -40 à 200℃
Tension de panne diélectrique: > 500 VAC Constante diélectrique: 7,0 MHz
Couleur: Gris foncé Gravité spécifique: 3.2 g/cc
Mots-clés: Remplisseur d'espace thermique Conductivité thermique: 4.0W/mK
Application: Processeurs IA Serveurs IA

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

The TIF®100-40-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit, It issuitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

 

Features:


> Good thermal conductive: 4.0W/mK 

> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®100-40-11U Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.2 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 4.0 W/m-K ASTM D5470
4.0 W/m-K ISO22007

Product Specifications


Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16" X16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

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