Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad for 5G Aerospace AI AIoT And Automotive

Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive

The TIF^®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Company Profile

A silicone thermal pad is a type of thermal interface material (TIM) which is highly conductive and comprises of conformable materials which are used to provide a heat path between heat sinks and electronic devices where uneven surface topography, air gaps and texture preclude good thermal transfer. Ziitek supply a wide range of silicone thermal pads with varying properties to suit every application.

Features

> Good thermal conductive: 3.0W/mK 
> Ultra-soft and highly conformable
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance

Applications

Electronic Components,5G,Aerospace,AI, AIoT, AR/VR/MR/XR, Automotive,
Consumer Devices,Datacom,Electric Vehicle,Electronic Products,Energy
Storage,Industrial, Lighting Equipment,Medical, Military,Netcom,Panel, Power
Electronics,Robot,Servers,Smart Home,Telecom,etc.