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Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
Chine Dongguan Ziitek Electronic Materials & Technology Ltd. certifications
La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !

—— Peter Goolsby

J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase

—— Antonello Sau

Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !

—— Chris Rogers

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Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Image Grand :  Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

Détails sur le produit:
Lieu d'origine: Chine
Nom de marque: ZIITEK
Certification: UL and RoHs
Numéro de modèle: TIF100-50-11ES
Conditions de paiement et expédition:
Quantité de commande min: 1000 pièces
Prix: Négociable
Détails d'emballage: 1000 pièces/sac
Délai de livraison: 3-5 jours ouvrables
Conditions de paiement: T/T
Capacité d'approvisionnement: 100000 pièces/jour
Description de produit détaillée
Nom du produit: Coussin thermique ultra doux à faible impédance thermique pour 5G, aérospatiale, IA et véhicule élec Épaisseur: 0,010 "(0,25 mm) ~ 0,200" (5,0 mm)
Conductivité thermique: 5.0W/m-k Mots-clés: Coussin thermique ultra doux
Dureté: 10 rivage 00 Densité: 3,3 g/cm³
Couleur: gris foncé Température de fonctionnement recommandée: -40 à 200℃
Application: 5G, aérospatiale, IA, véhicule électrique

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle

 

The TIF®100-50-11ES Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.

 

Features


> Good thermal conductive: 5.0W/mK 
> Moldability for complex parts
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Home appliance industry
> CPU
> Display card
> Mainboard/mother board
> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

 

Typical Properties of TIF®100-50-11ES Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
(0.50~0.75) (1.0~5.0)
Hardness 10 Shore 00 10 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0W/m-K ASTM D5470
5.0W/m-K ISO22007

 

Product Specifications
Standard Thickness: 0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.

Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle 0

Company profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Coordonnées
Dongguan Ziitek Electronic Materials & Technology Ltd.

Personne à contacter: Dana Dai

Téléphone: 18153789196

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