La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Goolsby
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello Sau
Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !
High Performance Acrylic Adhesive Heat-Conducting Double-Sided Adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductor... Lire la suite
High Temperature Heat Resistant Acrylic Adhesive Double Sided Thermal Conductive Tape for LED Light Heat dissipation tape The TIA™800FG Series products are mostly used for bonding heat dissipation fins, ... Lire la suite
The TIA™810FG Acrylic Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lire la suite
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lire la suite
Acrylic Thermal Adhesive Tape For LED Mount Heat Sink Conductive 0.8 W/MK The TIA™805FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconduct... Lire la suite
2.0W /mK thermal gap filler pad 3mmT Ziitek TIF4120 for Heat Sinking Housing at LED-lit BLU in LCD Company ProfileZiitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal ... Lire la suite
Excellent Flexibility Thermal Conductive High Heat Plastic Housings for LED Lamps Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Lire la suite
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Lire la suite
Gray Heat Dissipation Fins Thermal Gap Filler For notebook, -40 - 160℃ Continuos Use Temp 3.0 W/m-K The TIF120-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the ... Lire la suite
Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad The TIF110FG-14E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Lire la suite