La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Goolsby
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello Sau
Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !
Consumer Electronics Thermal Conductive Adhesive Tape 0.8W/MK Glass Fiber Backing Heat Resistant Tape The TIA®815 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal ... Lire la suite
Blue 3W Thermally Conductive Gel Thermal Gap Filler High Viscosity For Micro Heat Pipe TIF®030-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent ... Lire la suite
Thermal Management Materials 1.5W Silicone thermal gap pad for Chip heat dissipation Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise ... Lire la suite
3mm Thickness Thermal Pad Silicone Laptop Die Cuts High Cooling Thermal Heating Pads For Chipset Battery Factory Thermal Pad The TIF7120RUS is recommended for applications that require a minimum amount of ... Lire la suite
Highest Thermal Gap Filler Thermal Conductive Pad For Electronics Heat Transfer The TIF800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components ... Lire la suite
High Performance 1.6W/mK Aluminum Foil Double Sided Thermal Adhesive Tape For Power Converter PCB Heat Spreader The TIA® 800AL Series is widely used for bonding heat sinks to microprocessors and other power ... Lire la suite
Outgasing 0.35% UL recognized Conductive Pads for Micro Heat Pipe Thermal Solutions The TIF1160-05UF use a special process, with silicone as the base material, adding thermal conductive powder and flame ... Lire la suite
1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad The TIF®100-12-05ES is recommended for applications that require a minimum amount of pressure on ... Lire la suite
IGBTs Thermal Conductive Pad Designed For Filling Air Gaps Between Heating Elements And Metal Bases To Improve Heat Dissipation Product introduction The TIF® 100-20-18S Series thermally conductive interface ... Lire la suite