La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Goolsby
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello Sau
Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !
Ultra Thin LED Flat Light Thermal Adhesive Tape 0.8 W / mK with Double Sided Adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumptio... Lire la suite
Durable Thermal Adhesive Tape For Mounting Heat Sinks On BGA Chips And Power Converter PCBs With Strong Bond Strength The TIA® 800AL Series is widely used for bonding heat sinks to microprocessors and other ... Lire la suite
Double Sided Thermal Adhesive Tape For Heatsink Product Overview The TIA® 800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong ... Lire la suite
Stable Operation Over A Wide Temperature Range White 0.8W/MK Thermal Conductivity Double-Sided Adhesive Tape For Power Device The TIA®804 Series is filled with good thermal conductivity ceramic particles, ... Lire la suite
Fiberglass Backing Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA® 808FG Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconducto... Lire la suite
The TIA™810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low ... Lire la suite
High Performance blue Acrylic Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lire la suite
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Lire la suite
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Lire la suite
Heat Sink Acrylic Based Glue - Highly Double Side Thermal Conductive Acrylic Tape For SMD LED Module The TIA® 800FG Series is widely used for bonding heat sinks to microprocessors and other power consuming ... Lire la suite