La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Goolsby
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello Sau
Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !
—— Chris Rogers
Je suis en ligne une discussion en ligne
double sided self adhesive pads fabrication en ligne
7.5W Heat Transfer Thermal Silicone Gel Pads For AI Servers AI Processors The TIF®500-75-11US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Lire la suite
Soft Thermal Pad Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers The TIF®100-20-19S Series is a well-balanced, general-purpose thermal pad.It offers good thermal ... Lire la suite
High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers Company Profile With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek ... Lire la suite
Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive The TIF®100 3030-06 Series is an ultra-soft thermal interface material designed specifically to protect precision ... Lire la suite
Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal ... Lire la suite
High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR Company Profile Ziitek Electronic Material and Technology Ltd With professional R&D capabilities and many year experiences ... Lire la suite
3.0W Silicone Thermal Gap Pad For Network Communication Products TIF®500-30-11U Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced ... Lire la suite
Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling TIF®700NU is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely ... Lire la suite
Good Insulation Performance 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling The TIF®500-65-11U Series is an ultra-soft thermal interface material designed specifically to protect precision ... Lire la suite
High-Performance 8.0W Thermal Gap Filler Pad For Lndustrial Equipment TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid ... Lire la suite