La protection conductrice thermique est regardante et travaillante très bon. Nous n'avons aucun besoin de l'autre protection conductrice thermique maintenant !
—— Peter Goolsby
J'avais coopéré avec Ziitek pendant 2 années, ils ont fourni les matériaux conducteurs thermiques de haute qualité, et la livraison à temps, recommandent leurs matériaux de changement de phase
—— Antonello Sau
Bonne qualité, bon service. Votre équipe nous donnent toujours l'aide et la résolution, espoir que nous serons bon associé tout le temps !
—— Chris Rogers
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Laptop GPU 7.5W Ultra Soft High Conductivity Ideal Gap Filler pad For AI Servers Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Lire la suite
Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad The TIF110FG-14E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Lire la suite
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Thermal Conductive Pad Soft Highly Conformable Material With 1.5WmK Thermal Conductivity For Electric Vehicle Batteries The TIF® 200-02US Series is a compound thermal interface material that combines good ... Lire la suite
Good Performance Thermal Gap Filler Ceramic Filled Silicone PAD For Thermal Management In Electronics Company Profile Dongguan Ziitek Electronic Material and Technology Ltd., established in 2006, is a high-tech ... Lire la suite
Eco-Friendly Thermal Interface Material Highly Compressible Thermal Interface Thermal Pad For Dissipate Heat Of LED Display Power Supply Products description The TIF®100-50-11E Series is awell-balanced,general... Lire la suite
Low Volatility Silicone Thermally Conductive Gap Filler Pads For Embedded Motherboard Products description The TIF® 100L 2050-06 eries is a thermal pad with ultra-lowsiliconoxygen volatilization, designed ... Lire la suite
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Thermal Conductive Pad for Heat Dissipation in Electronic Devices TIF®100-10F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and ... Lire la suite